Jiangsu, China
Business Type:
Management System Certification:
ISO 9001, ISO 9000
OEM/ODM Service

Diamond Saw Blade, Diamond Tool for Silicon, Diamond Cutter for Semiconductors manufacturer / supplier in China, offering Diamond Grinding Plate for Semiconductors, Diamond Segment, Diamond Saw Blade, Diamond Saw Blade, for Glass, Glass Cutting, Thick Glass, Diamond Cutting Wheel and so on.

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Diamond Grinding Plate for Semiconductors

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Min. Order: 10 Pieces
Production Capacity: 50000PCS/Year
Transport Package: Carton
Payment Terms: L/C, T/T
Material: Diamond
Abrasive: Superabrasive
Shapes: Section Shape
Types: Surface Grinding Wheel
Working Style: Surface Grinding
Trademark: XIN YA

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Basic Info

Origin: China
HS Code: 8207201000

Product Description

Diamond Grinding Plate are used for grinding Semiconductors material, such as silicon, sapphire.
The special diamond grinding plate for Semiconductors material have the highest sharpness and the best cutting effect. They are designed for grinding silicon ingot, sapphire ingot and so on.

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avatar Mr. Wang Peng

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