Gold Member Since 2009
Audited Supplier
Zhenjiang Reco New Material Co., Ltd.

Diamond Saw Blade, Diamond Tool for Silicon, Diamond Cutter for Semiconductors manufacturer / supplier in China, offering Diamond Band Saw for Semiconductors, Silicon, Sapphire, Glass, Waffer, Stone, Ceramic, Diamond Segment, Diamond Saw Blade, Diamond Saw Blade, for Glass, Glass Cutting, Thick Glass, Diamond Cutting Wheel and so on.

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Supplier Homepage Product Diamond tools for Semiconductors Diamond Band Saw for Semiconductors, Silicon, Sapphire, Glass, Waffer, Stone, Ceramic

Diamond Band Saw for Semiconductors, Silicon, Sapphire, Glass, Waffer, Stone, Ceramic

Purchase Qty.:
5-49 50-199 200-499 500-999 1,000+
FOB Unit Price: US $105 US $103 US $101 US $98 US $96
Purchase Qty. (Pieces) FOB Unit Price
5-49 US $105
50-199 US $103
200-499 US $101
500-999 US $98
1,000+ US $96
Get Latest Price
Production Capacity: 50000PCS/Year
Transport Package: Carton
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: L1800~L7800
  • Thickness: 0.3~0.8
  • Kind: Band Saw Cutting Machine
  • Usage: Stone Cutting, Optical Glass Cutting, Lab Use Super-thin Saw Blade, Semiconductor Cutting, Arts Cutting, Plastics, Laminate Plate, for Semiconductors Cutting
  • Saw Blade External Diameter: L1800~L7800
  • Customized: Customized
  • Shank Thick: 0.7
  • Trademark: XIN YA
  • HS Code: 8202200000
  • Graininess: 100#
  • Shape: Circular
  • Manufacturing Arts: Electroplating
  • Brand: Xinya
  • Specification: L1800~L7800, SGS
  • Length: 3750
  • Width: 38
  • Origin: China
Product Description
LengthWidthShank thicknessTip thicknessDiamond gritTip shape
2700mm10/20/38/400.4/0.5/0.6/mm0.6/0.7/0.8mm140/170half-moon/straight line
3230mm20/38/400.5/0.6/0.7mm0.8/0.9/1.0mm100/120half-moon/straight line
3750mm30/38/400.5/0.6/0.7mm0.8/0.9/1.0mm100/120half-moon/straight line
3920mm30/38/400.5/0.6/0.7mm0.8/0.9/1.0mm100/120half-moon/straight line
4410mm38/400.5/0.6/0.7mm0.8/0.9/1.0mm100/120half-moon/straight line
5700mm38/400.5/0.6/0.7mm0.8/0.9/1.0mm100/120half-moon/straight line
  The electroplated diamond band saw blades are used for cutting Semiconductors material, such as silicon, sapphire.
The special diamond saw blades for Semiconductors material have the highest sharpness and the best cutting effect. They are designed for cutting silicon ingot, sapphire ingot and so on.
  This kind of electroplated Diamond Band Saw have good sharpness and long life time,the single-deck on the surface of cutting part,so the cutting precision and the shape keeping performance all can be guaranteed.
  In the processing of the electroplated diamond band saw,the heating temperature of the diamond is less than 100ºC,so the damage to the diamond is very small,then the Electroplated Diamond Band Saw can also have the good long life time.
  Try it,and you will love it!
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