Diamond Band Saw for Semiconductors, Silicon, Sapphire, Glass, Waffer, Stone, Ceramic
|5-49 50-199 200-499 500-999 1,000+|
|FOB Unit Price:||US $105 US $103 US $101 US $98 US $96|
|Purchase Qty. (Pieces)||FOB Unit Price|
|Payment Terms:||L/C, T/T|
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- Model NO.: L1800~L7800
- Thickness: 0.3~0.8
- Kind: Band Saw Cutting Machine
- Usage: Stone Cutting, Optical Glass Cutting, Lab Use Super-thin Saw Blade, Semiconductor Cutting, Arts Cutting, Plastics, Laminate Plate, for Semiconductors Cutting
- Saw Blade External Diameter: L1800~L7800
- Customized: Customized
- Shank Thick: 0.7
- Trademark: XIN YA
- HS Code: 8202200000
- Graininess: 100#
- Shape: Circular
- Manufacturing Arts: Electroplating
- Brand: Xinya
- Specification: L1800~L7800, SGS
- Length: 3750
- Width: 38
- Origin: China
|Length||Width||Shank thickness||Tip thickness||Diamond grit||Tip shape|
The special diamond saw blades for Semiconductors material have the highest sharpness and the best cutting effect. They are designed for cutting silicon ingot, sapphire ingot and so on.
This kind of electroplated Diamond Band Saw have good sharpness and long life time,the single-deck on the surface of cutting part,so the cutting precision and the shape keeping performance all can be guaranteed.
In the processing of the electroplated diamond band saw,the heating temperature of the diamond is less than 100ºC,so the damage to the diamond is very small,then the Electroplated Diamond Band Saw can also have the good long life time.
Try it,and you will love it!