Gold Member Since 2009
Audited Supplier
Zhenjiang Reco New Material Co., Ltd.

Diamond Wire, Diamond Tools for Sapphire, Diamond Saw Blade manufacturer / supplier in China, offering Diamond Wire for Sapphire, Silicon, Waffer, Semiconductor, Wire Cutting, Diamond Segment, Diamond Saw Blade, Diamond Saw Blade, for Glass, Glass Cutting, Thick Glass, Diamond Cutting Wheel and so on.

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Supplier Homepage Product Diamond wire Diamond Wire for Sapphire, Silicon, Waffer, Semiconductor, Wire Cutting

Diamond Wire for Sapphire, Silicon, Waffer, Semiconductor, Wire Cutting

Purchase Qty.:
10,000-49,999 50,000-199,999 200,000-999,999 1,000,000-4,999,999 5,000,000+
FOB Unit Price: US $0.115 US $0.108 US $0.102 US $0.096 US $0.094
Purchase Qty. (Meters) FOB Unit Price
10,000-49,999 US $0.115
50,000-199,999 US $0.108
200,000-999,999 US $0.102
1,000,000-4,999,999 US $0.096
5,000,000+ US $0.094
Get Latest Price
Production Capacity: 5000000meters/Year
Transport Package: Carton
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: DW 100-500
  • Thickness: 0.1~0.50
  • Kind: Processing of Sapphire
  • Usage: Stone Cutting, Engineering Material, Optical Glass Cutting, Lab Use Super-thin Saw Blade, Semiconductor Cutting, Arts Cutting, Plastics, Laminate Plate
  • Saw Blade External Diameter: 0.10mm~0.50mm
  • Customized: Customized
  • Diamond Grit: 35~40 Microns
  • Type of Technical: Electroplated
  • Origin: China
  • Graininess: 300#
  • Shape: Single Straight
  • Manufacturing Arts: Electroplating
  • Brand: Xinya
  • Specification: 0.25, SGS
  • Diameter: 0.25
  • Core Wire: 0.18mm
  • Trademark: XIN YA
  • HS Code: 8207201000
Product Description
Core wire
Diamond Grit
Type of technicalBreak strength
Length of one spool
  Electroplated diamond wire is a type of fixed abrasive diamond wire. It's used for cutting Semiconductors material, such as silicon, sapphire. Based on the abrasion and cutting principle between the abrasive fixed on the steel wire and the workpiece materials, the abrasive particles do not directly act on the wire saw. Such rigid cutting method greatly improved the cutting efficiency.
  Product advantages:
1) Capable of cutting large-sized ingots; Material-saving, high-efficiency and cost-effective
2) Capable of cutting materials with high rigidity and high brittleness such as sapphire
3) Little damage on the processed surface, little deformation
4) Thin slices, with uniform thickness.
  In the processing of the electroplated diamond wire,the heating temperature of the diamond is less than 100ºC,so the damage to the diamond is very small,then the Electroplated Diamond Wire can also have the good long life time.
  Try it,and you will love it!
  Customized size available on request.
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