Diamond Wire Saw, Diamond Wire for Sapphire, Silicon, Waffer, Semiconductor, Wire Cutting

Purchase Qty.:
(Meters)
10,000-49,999 50,000-199,999 200,000-499,999 500,000-1,999,999 2,000,000+
FOB Unit Price: US $0.121 US $0.118 US $0.115 US $0.112 US $0.108
Purchase Qty. (Meters) FOB Unit Price
10,000-49,999 US $0.121
50,000-199,999 US $0.118
200,000-499,999 US $0.115
500,000-1,999,999 US $0.112
2,000,000+ US $0.108
Production Capacity: 5000000meters/Year
Transport Package: Carton
Payment Terms: L/C, T/T
Diamond Wire Saw, Diamond Wire for Sapphire, Silicon, Waffer, Semiconductor, Wire Cutting

Basic Info

Product Description

  • Model NO.: DW 100-500
  • Core Wire: 0.25
  • Type of Technical: Electroplated
  • Thickness: 0.1~0.50
  • Kind: Processing of Solar Silicon
  • Usage: Stone Cutting, Semiconductor Cutting, Lab Use Super-thin Saw Blade, Optical Glass Cutting, Arts Cutting, Engineering Material
  • Saw Blade External Diameter: 0.10mm~0.50mm
  • Customized: Customized
  • Origin: China
  • Diameter: 0.33
  • Diamond Grit: 35~40 Microns
  • Graininess: 300#
  • Shape: Single Straight
  • Manufacturing Arts: Electroplating
  • Brand: Xinya
  • Specification: 0.33, SGS
  • Trademark: XIN YA
  • HS Code: 8207201000

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