Diamond Grinding Blade for Semiconductors, Diamond Disc, Diamond Wheel. Electroplade Diamond Tools for Silicon, Diamond Wheels for Surface Grinding
|10-99 100-999 1,000-4,999 5,000-9,999 10,000+|
|FOB Unit Price:||US $6 US $5.8 US $5.5 US $5.2 US $5|
|Purchase Qty. (Pieces)||FOB Unit Price|
|Payment Terms:||L/C, T/T|
- Model NO.: D50~D200
- Abrasive: Superabrasive
- Types: Surface Grinding Wheel
- Cylindricity: <0.02
- Technics: Electroplating
- Diameter: 100mm
- Hole Size: 20mm
- Type of Technical: Electroplated
- Specification: SGS
- HS Code: 8207201000
- Material: Diamond
- Shapes: Section Shape
- Grain Size: 46#
- Circular Degree: <0.01
- Working Style: Surface Grinding
- Thickness: 2.0mm
- Diamond Grit: 40/50
- Trademark: XIN YA
- Origin: China
|Diamond Grit||Type of technical|
The special diamond grinding plate for Semiconductors material have the highest sharpness and the best cutting effect. They are designed for grinding silicon ingot, sapphire ingot and so on.
The Diamond grinding wheel for Semiconductors is one kind of electroplated diamond grinding wheel.This kind of electroplated Diamond Grinding Wheel have good sharpness and long life time,the single-deck on the surface of diamond grinding wheel,so the grinding precision and the shape keeping performance all can be guaranteed.
In the processing of the electroplated diamond grinding wheel,the heating temperature of the diamond is less than 100ºC,so the damage to the diamond is very small,then the Electroplated Diamond Grinding Wheel can also have the good long life time.
Try it,and you will love it!
Customized size available on request.