Gold Member Since 2009
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Yangzhong Xinya Diamond Tool Factory

Diamond Saw Blade, Diamond Tool for Silicon, Diamond Cutter for Semiconductors manufacturer / supplier in China, offering Diamond Grinding Plate for Semiconductors, Diamond Cutting Wheel, Diamond Saw Blade, Diamond Saw Blade, for Glass, Glass Cutting, Thick Glass,, Diamond Grinding Head and so on.

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Supplier Homepage Product Diamond tools for Semiconductors Diamond Grinding Plate for Semiconductors

Diamond Grinding Plate for Semiconductors

FOB Price: Get Latest Price
Min. Order: 10 Pieces
Production Capacity: 50000PCS/Year
Transport Package: Carton
Payment Terms: L/C, T/T

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Basic Info
  • Material: Diamond
  • Shapes: Section Shape
  • Working Style: Surface Grinding
  • Origin: China
  • Abrasive: Superabrasive
  • Types: Surface Grinding Wheel
  • Trademark: XIN YA
  • HS Code: 8207201000
Product Description
Diamond Grinding Plate are used for grinding Semiconductors material, such as silicon, sapphire.
The special diamond grinding plate for Semiconductors material have the highest sharpness and the best cutting effect. They are designed for grinding silicon ingot, sapphire ingot and so on.
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Ms. Cao Qiaoyun
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