Diamond Band Saw for Semiconductors, Silicon, Sapphire, Glass, Waffer, Stone, Ceramic

Purchase Qty.:
(Pieces)
5-49 50-199 200-499 500-999 1,000+
FOB Unit Price: US $105 US $103 US $101 US $98 US $96
Purchase Qty. (Pieces) FOB Unit Price
5-49 US $105
50-199 US $103
200-499 US $101
500-999 US $98
1,000+ US $96
Production Capacity: 50000PCS/Year
Transport Package: Carton
Payment Terms: L/C, T/T
Diamond Band Saw for Semiconductors, Silicon, Sapphire, Glass, Waffer, Stone, Ceramic

Basic Info

Product Description

  • Model NO.: L1800~L7800
  • Thickness: 0.3~0.8
  • Kind: Band Saw Cutting Machine
  • Usage: Stone Cutting, Optical Glass Cutting, Lab Use Super-thin Saw Blade, Semiconductor Cutting, Arts Cutting, Plastics, Laminate Plate, for Semiconductors Cutting
  • Saw Blade External Diameter: L1800~L7800
  • Customized: Customized
  • Shank Thick: 0.7
  • Trademark: XIN YA
  • HS Code: 8202200000
  • Graininess: 100#
  • Shape: Circular
  • Manufacturing Arts: Electroplating
  • Brand: Xinya
  • Specification: L1800~L7800, SGS
  • Length: 3750
  • Width: 38
  • Origin: China

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