- Kind: Plane Saw
- Usage: for Semiconductors Cutting
- Trademark: XIN YA
- HS Code: 8202390000
- Manufacturing Arts: Welding
- Saw Blade External Diameter: 100~600
- Origin: China
The special diamond saw blades for Semiconductors material have the highest sharpness and the best cutting effect. They are designed for cutting silicon ingot, sapphire ingot and so on.