Gold Member Since 2009
Audited Supplier
Yangzhong Xinya Diamond Tool Factory

Diamond Wire, Diamond Tools for Sapphire, Diamond Saw Blade manufacturer / supplier in China, offering Diamond Wire, Diamond Wire for Sapphire, Cutting Silicon, Waffer Cutting, Semiconductor Processing, Wire Cutting, Diamond Segment, Diamond Saw Blade, Diamond Saw Blade, for Glass, Glass Cutting, Thick Glass, Diamond Cutting Wheel and so on.

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Supplier Homepage Product Diamond tools for Semiconductors Diamond Wire, Diamond Wire for Sapphire, Cutting Silicon, Waffer Cutting, Semiconductor Processing, Wire Cutting

Diamond Wire, Diamond Wire for Sapphire, Cutting Silicon, Waffer Cutting, Semiconductor Processing, Wire Cutting

Purchase Qty.:
(Meters)
10,000-49,999 50,000-99,999 100,000-499,999 500,000-4,999,999 5,000,000+
FOB Unit Price: US $0.128 US $0.123 US $0.118 US $0.116 US $0.115
Purchase Qty. (Meters) FOB Unit Price
10,000-49,999 US $0.128
50,000-99,999 US $0.123
100,000-499,999 US $0.118
500,000-4,999,999 US $0.116
5,000,000+ US $0.115
Get Latest Price
Production Capacity: 5000000meters/Year
Transport Package: Carton
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: DW 120-500
  • Thickness: 0.1~0.50
  • Kind: Processing of Sapphire
  • Usage: Stone Cutting, Abrasive and Carving, Optical Glass Cutting, Semiconductor Cutting, Arts Cutting
  • Saw Blade External Diameter: 0.10mm~0.50mm
  • Customized: Customized
  • Core Wire: 0.25mm
  • Break Strength: 165 N
  • Origin: China
  • Graininess: 300#
  • Shape: Single Straight
  • Manufacturing Arts: Electroplating
  • Brand: Xinya
  • Specification: 0.1~0.50, SGS
  • Diameter: 0.33mm
  • Diamond Grit: 35~40microns
  • Trademark: XIN YA
  • HS Code: 8207201000
Product Description
Diameter
(mm)
Core wire
(mm)
Diamond Grit
(microns)
Type of technicalBreak strength
(N)
Length of one spool
(KM)
0.100.088~10Electroplated3550
0.120.108~10Electroplated4550
0.150.1210~15Electroplated5550
0.250.1835~40Electroplated9540
0.330.2535~40Electroplated16540
0.390.3045~50Electroplated23540
0.420.3345~50Electroplated28540
0.450.3545~50Electroplated32040
0.500.3850~60Electroplated42540
  Electroplated diamond wire is a type of fixed abrasive diamond wire. It's used for cutting Semiconductors material, such as silicon, sapphire. Based on the abrasion and cutting principle between the abrasive fixed on the steel wire and the workpiece materials, the abrasive particles do not directly act on the wire saw. Such rigid cutting method greatly improved the cutting efficiency.
  Product advantages:
1) Capable of cutting large-sized ingots; Material-saving, high-efficiency and cost-effective
2) Capable of cutting materials with high rigidity and high brittleness such as sapphire
3) Little damage on the processed surface, little deformation
4) Thin slices, with uniform thickness.
  In the processing of the electroplated diamond wire,the heating temperature of the diamond is less than 100ºC,so the damage to the diamond is very small,then the Electroplated Diamond Wire can also have the good long life time.
  Try it,and you will love it!
  Customized size available on request.
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Ms. Cao Qiaoyun
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