Diamond Wire for Sapphire, Silicon, Waffer, Semiconductor, Wire Cutting

Purchase Qty.:
(Meters)
10,000-49,999 50,000-199,999 200,000-999,999 1,000,000-4,999,999 5,000,000+
FOB Unit Price: US $0.115 US $0.108 US $0.102 US $0.096 US $0.094
Purchase Qty. (Meters) FOB Unit Price
10,000-49,999 US $0.115
50,000-199,999 US $0.108
200,000-999,999 US $0.102
1,000,000-4,999,999 US $0.096
5,000,000+ US $0.094
Production Capacity: 5000000meters/Year
Transport Package: Carton
Payment Terms: L/C, T/T
Diamond Wire for Sapphire, Silicon, Waffer, Semiconductor, Wire Cutting

Basic Info

Product Description

  • Model NO.: DW 100-500
  • Thickness: 0.1~0.50
  • Kind: Processing of Sapphire
  • Usage: Stone Cutting, Engineering Material, Optical Glass Cutting, Lab Use Super-thin Saw Blade, Semiconductor Cutting, Arts Cutting, Plastics, Laminate Plate
  • Saw Blade External Diameter: 0.10mm~0.50mm
  • Customized: Customized
  • Diamond Grit: 35~40 Microns
  • Type of Technical: Electroplated
  • Origin: China
  • Graininess: 300#
  • Shape: Single Straight
  • Manufacturing Arts: Electroplating
  • Brand: Xinya
  • Specification: 0.25, SGS
  • Diameter: 0.25
  • Core Wire: 0.18mm
  • Trademark: XIN YA
  • HS Code: 8207201000

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Ms. Cao Qiaoyun

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